20445-88-9

  • Product NameHishicolin px-4mp
  • Purity99%
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Product Details

Quick Details

  • CasNo: 20445-88-9
  • Purity: 99%

20445-88-9 Properties

  • Molecular Formula:C13H30P.C2H6O4P
  • Molecular Weight:342.396
  • PSA:81.99000 
  • LogP:5.85190 

20445-88-9 Relevant articles

Physicochemical properties of tri-n-butylalkylphosphonium cation-based room-temperature ionic liquids

Yoshii, Kazuki,Yamaji, Keisuke,Tsuda, Tetsuya,Tsunashima, Katsuhiko,Yoshida, Hiroyuki,Ozaki, Masanori,Kuwabata, Susumu

, p. 15051 - 15059 (2013)

The physicochemical properties of novel four tri-n-butylalkylphosphonium- based room-temperature ionic liquids (RTILs), tri-n-butylmethylphosphonium dimethylphosphate ([P4,4,4,1][DMP]), tri-n-butyl(2-hydroxymethyl) phosphonium bis(trifluoromethylsulfonyl)amide ([P4,4,4,2OH][Tf 2N]), tetra-n-butylphosphonium O,Oa?2-diethylphosphorodithioate ([P4,4,4,4][DEPDT]), and tri-n-butyldodecylphosphonium 3,5-bis(methoxycarbonyl)benzenesulfonate ([P4,4,4,12][MCBS]), were examined in this study. All RTILs showed a favorable thermal decomposition temperature exceeding 560 K. Of these, [P4,4,4,12][MCBS] exhibited a fairly high thermal stability compared with common phosphonium cation-based RTILs reported to date. Interestingly [P4,4,4,1][DMP] formed an ionic plastic crystal phase within a range of 279-290 K, but that was not the case with [P4,4,4,4][DEPDT], which is similar in the cation and anion structures to the [P4,4,4,1]+ and [DMP]-. [P4,4,4,2OH][Tf2N] showed a relatively high conductivity of 0.48 mS cm-1 at 303 K among the RTILs consisting of tri-n-butylalkylphosphonium cation and usual fluoroanion. ? 2013 American Chemical Society.

CURING ACCELERATOR FOR DEEP-ULTRAVIOLET-TRANSMITTING EPOXY RESIN, DEEP-ULTRAVIOLET-TRANSMITTING EPOXY RESIN COMPOSITION, AND DEEP-ULTRAVIOLET-TRANSMITTING EPOXY RESIN CURED PRODUCT

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Page/Page column 9; 10, (2010/11/03)

An object of the present invention is to provide a deep-ultraviolet-transmitting epoxy resin cured product having high heat resistance and high resistance to deep-ultraviolet light, and to provide a curing accelerator and an epoxy resin composition which are used for producing the epoxy resin cured product. The curing accelerator for deep-ultraviolet-transmitting epoxy resins comprises a tetraalkylphosphonium dialkyl phosphate represented by the following general formula (1): wherein R1, R2, R3, R4, R5, and R6 each represent an alkyl group or an alkyl group having a hydroxyl group, which has 1 to 8 carbon atoms and is linear, branched, or alicyclic; and R1, R2, R3, R4, R5, and R6 may be the same or different. Also disclosed are an epoxy resin composition comprising the curing accelerator and an epoxy resin cured product obtained by curing the resin composition.

20445-88-9 Process route

dimethylphosphoric acid
813-78-5

dimethylphosphoric acid

methyltributylphosphonium chloride
2304-24-7

methyltributylphosphonium chloride

tri-n-butyl(methyl)phosphonium dimethyl phosphate
20445-88-9

tri-n-butyl(methyl)phosphonium dimethyl phosphate

Conditions
Conditions Yield
With sodium hydroxide; In water; at 20 ℃; for 6h;
trimethyl phosphite
512-56-1

trimethyl phosphite

tributylphosphine
998-40-3

tributylphosphine

tri-n-butyl(methyl)phosphonium dimethyl phosphate
20445-88-9

tri-n-butyl(methyl)phosphonium dimethyl phosphate

Conditions
Conditions Yield
at 120 ℃; for 8h; Inert atmosphere;
In neat (no solvent);

20445-88-9 Upstream products

  • 813-78-5
    813-78-5

    dimethylphosphoric acid

  • 2304-24-7
    2304-24-7

    methyltributylphosphonium chloride

  • 512-56-1
    512-56-1

    trimethyl phosphite

  • 998-40-3
    998-40-3

    tributylphosphine